| 电子陶瓷材料在多芯片组件(MCM)中的应用 |
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| 引用本文： | 蔡瑞琦,李黎明,徐政. 电子陶瓷材料在多芯片组件(MCM)中的应用[J]. 现代技术陶瓷, 2005, 27(3): 26-29 |
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| 作者姓名： | 蔡瑞琦 李黎明 徐政 |
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| 作者单位： | 同济大学材料学院微电子材料研究所,上海,200092 |
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| 摘 要： | 论述了电子陶瓷在多芯片组件（MCM）中的应用、性能要求及优点。重，最叙述低温共烧陶瓷基板技术以及A1N陶瓷基板材料的合成与优异性能。
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| 关 键 词： | 电子陶瓷材料 多芯片组件 MCM 合成方法 共烧陶瓷多层基板技术 |
Application of Electronic Ceramics in MCM |
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| Cai Ruiqi,Li Liming,Xu Zheng. Application of Electronic Ceramics in MCM[J]. Advanced Ceramics, 2005, 27(3): 26-29 |
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| Authors: | Cai Ruiqi Li Liming Xu Zheng |
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| Affiliation: | Research Institute of Micro- Electronics Material , Tongji University, Shanghai 200092 |
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| Abstract: | In this thesis, the application and the requirements of the charact er s and excellent performance of the electronic ceramics used in the MCM encapsula tion were introduced with the emphasis on the new LTCC (low temperature co-fire ceramic) technology and the composition of AlN ceramic materials and its excell ent performance. |
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| Keywords: | electronic ceramics MCM low temperature co -fired ceramic substrate A1N |
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