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化学镀镍铜磷在钕铁硼表面处理上的应用研究
引用本文:欧萌,张蕾. 化学镀镍铜磷在钕铁硼表面处理上的应用研究[J]. 电子工艺技术, 2001, 22(4): 157-160
作者姓名:欧萌  张蕾
作者单位:信息产业部电子第二研究所,
摘    要:为提高钕铁硼表面镀层的耐蚀性,使其具有更高的经济附加值,采用在化学镀镍磷合金液中添加适量的铜离子及其复合络合剂,制得镍铜磷三元合金。研究了镍离子、铜离子、次亚磷酸钠、复合络合剂添加量,沉积温度、pH值对合金镀层沉积速度的影响。利用中性盐雾试验比较了其与电镀镍、化学镀镍磷合金的耐蚀性能。结果表明:化学镀镍铜磷合金能明显提高钕铁硼表面处理后的耐蚀能力。

关 键 词:化学镀 镍铜磷 钕铁硼 三元合金 表面处理 电镀
文章编号:1001-3474(2001)04-0157-04
修稿时间:2001-04-06

Study of Electroless Ni-Cu-P In NdFeB Surface Treatment
OU Meng,ZHANG Lei. Study of Electroless Ni-Cu-P In NdFeB Surface Treatment[J]. Electronics Process Technology, 2001, 22(4): 157-160
Authors:OU Meng  ZHANG Lei
Abstract:The purpose of this study is to improve NdFeB surface plating corrosive resistance and additional economic value.Electroless Ni-Cu-P ternary alloy deposits are prepared by addition of cupric sulfate and complex in eletroless Ni-P alloy plating bath.The effect of nickel copper,concentration of sodium hypophoshite,complex,deposition temperature and pH on alloy deposition rate are studied.The corrosion resistance of electroless Ni-Cu-P alloy deposits are compared with that electroplating Ni and electroless Ni-P alloy deposits by corrosion tests.The results indicate that NdFeB layer are greatly improved in corrosion resistance by electroless Ni-Cu-P ternary alloy.
Keywords:Electroless  Ni-Cu-P  NdFeB  Ternary alloy
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