基于Minitab DOE的铝丝楔焊键合工艺参数优化

为提高国产陶瓷外壳用于铝丝楔焊键合的可靠性和产品质量,利用Minitab统计软件对一种封装形式为CQFP84的国产陶瓷外壳用于铝丝楔焊键合的工艺参数进行试验设计,并对试验结果进行直观分析和方差分析。讨论过键合功率、键合压力、键合时间及超声功率缓慢上升时间(Ramp)对键合拉力的影响及其显著程度。试验研究表明第2段参数的键合压力、第2段参数的键合功率及第1段参数的Ramp对键合拉力值有显著影响,以键合拉力为参考指标,得到了较优的键合工艺参数,通过验证试验键合拉力相比工艺参数优化前有明显提高,分散度也有明显改善,达到了提高产品可靠性的目标。

Optimization of Aluminum Wedge Bonding Process Parameters Based on Minitab DOE

Design of experiments have been done by using Minitab statistical software to improve the reliability and product quality of domestic ceramics packages, which are used for aluminum wedge bonding process. And intuitive analysis and variance analysis of the design of experiments results of CQFP84 domestic ceramic package, which are used for aluminum wedge bonding process have been done. Ultrasonic power, ultrasonic time, bonding force and ultrasonic power ramp time on the effect of the bonding pull and its significant level have been discussed. The study shows that the second parameter of bonding pressure and ultrasonic power, and the first parameter of ultrasonic power ramp time have significant influences on bonding pull. Better bonding process parameters are obtained as bonding pull for a reference index. Bonding pull is obviously enhanced through validation experiment, and its dispersion has been improved significantly.