| 表面贴装工艺（SMT）,其趋势和未来 |
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| 引用本文： | 徐大林.表面贴装工艺（SMT）,其趋势和未来[J].电子器件,1999,22(2):104-109. |
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| 作者姓名： | 徐大林 |
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| 作者单位： | 中国船舶工业总公司第七一六研究所 |
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| 摘 要： | 表面贴装工艺（ＳＭＴ）是一种当今制造生产先进水平微小型电子产品的工艺技术，本文首先介绍ＳＭＴ，然后着重阐述表面贴装的种类及工艺流程，所需设备，ＳＭＴ中的技术问题，最后就ＳＭＴ的趋势和它的未来进行探讨。
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| 关 键 词： | SMT 工艺流程 表面贴装 电子元器件 |
Surface Mount Technology(SMT), its Trends and Future |
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| XU Da,lin.Surface Mount Technology(SMT), its Trends and Future[J].Journal of Electron Devices,1999,22(2):104-109. |
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| Authors: | XU Da lin |
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| Affiliation: | The 716 th Institute of CSSC |
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| Abstract: | Surface mount technology (SMT) is a technology of today that make it possible to produce state of the art miniaturized electronic products. In this article, SMT is introduced firstly, then the types of surface mounting, process, equipment, and the technical issues in surface mounting are expounded. The trends and future in surface mounting are discussed, finally. |
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| Keywords: | SMT process type trends future |
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