| Abstract: | Partial transient liquid-phase bonding (PTLP bonding) of Si3N4 ceramic with Ti/Cu/Ti multi-interlayer is performed with changing the thickness of Ti foil. The influence of Ti foil thickness on interface structure and joint strength was discussed. The joint interface structures are investigated by scanning electron microscope (SEM) and energy dispersion spectroscopy(EDS). The results show that the maximum joint strength of 210 MPa is obtained at room temperature in the experiments. When joining temperature and time are not changed and the process of isothermal solidification is sufficient,interface structure, reaction layer thickness and isothermal solidification thickness change with the thickness of Ti foil. |
