| 陶瓷球栅阵列焊点连接改进措施分析 |
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| 引用本文： | 刘丙金,李旭珍. 陶瓷球栅阵列焊点连接改进措施分析[J]. 电子测试, 2020, 0(9): 64-65 |
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| 作者姓名： | 刘丙金 李旭珍 |
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| 作者单位： | 西安航空计算技术研究所;杨凌职业技术学院 |
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| 摘 要： | 针对陶瓷球栅阵列封装的焊点连接问题,提出一种相对比较完善的改进措施,并进行了理论分析、仿真和试验验证,为陶瓷球栅阵列封装的合理选型提出了建议。
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| 关 键 词： | CBGA 焊球 陶瓷 可靠性 |
Analysis of Improvement for Soldering Joint Connection of Ceramic Ball Grid Array |
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| Liu Bingjin,Li Xuzhen. Analysis of Improvement for Soldering Joint Connection of Ceramic Ball Grid Array[J]. Electronic Test, 2020, 0(9): 64-65 |
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| Authors: | Liu Bingjin Li Xuzhen |
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| Affiliation: | (Xi'an Aeronautics Computing Technique Research Institute,AVIC,Xian Shaanxi,710065;Yangling Vocational&Technical College,Xianyang Shaanxi,712100) |
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| Abstract: | For the soldering joint connection problem of ceramic ball grid array,a relatively perfect improvement measure was put forward,theoretical analysis,simulation and experimental verification were carried out,and suggestions for the reasonable selection of ceramic ball gird array packaging were put forward. |
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| Keywords: | CBGA ball ceramic reliability |
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