Forming properties and springback evaluation of copper beryllium sheets |
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Authors: | A A Tseng K P Jen T C Chen R Kondetimmamhalli Y V Murty |
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Affiliation: | (1) Villanova, PA;(2) Tainan, Taiwan, Republic of China;(3) Drexel University, 19104 Philadelphia, PA;(4) AMP Inc., 17111 Harrisburg, PA |
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Abstract: | Copper beryllium (CuBe) alloys possess excellent strength and conductivity. They have become the most important materials
used for producing high reliability connectors and interconnections for electrical and electronic applications. As demand
for high connection density in electrical and electronic products grows, springback behaviors become increasingly critical
in fabricating these miniaturized contact components from sheet base materials. In the present article, a study of the springback
behavior of CuBe sheets under different heat treatments is presented, with the goal of providing reliable information needed
for fabricating more intricate connection parts. Both experimental and analytical techniques were adopted. The tensile tester
was first used to study the springback related tensile properties. The governing tensile parameters on springback were identified,
and their variations for sheets with different heat treatments were studied. It was found that a bilinear constitutive relationship
can best characterize the stress strain behavior of the CuBe alloy. A closed form solution based on this bilinear relationship
was formulated to predict the springback for the CuBe sheets at bending conditions. A V-shaped bend tester having an interchangeable
punch to accommodate multiple radii was designed and built to evaluate the springback properties of CuBe sheets. A good correlation
was found between the analytical predictions and experimental data. A parametric study, as an example, was also performed
to provide the springback information needed for designing complicated connectors.
formerly Director of R&D with NGK Metals Corp., Reading, PA 19612 |
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