| 电子组装中助焊剂的选择(待续) |
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| 引用本文： | 史建卫,许愿,王建斌,梁权.电子组装中助焊剂的选择(待续)[J].电子工艺技术,2009,30(3). |
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| 作者姓名： | 史建卫 许愿 王建斌 梁权 |
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| 作者单位： | 1. 日东电子科技(深圳)有限公司,广东,深圳,518103
2. 德邦科技有限公司,山东,烟台,264006 |
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| 摘 要： | 助焊剂是电子组装技术中最重要的材料之一,通过其去除材料表面氧化膜及污染物等,保证钎料和母材之间很好地润湿,形成良好焊点.介绍了助焊剂的作用与组成、分类与性能要求以及涂覆方式和工艺评定,有助于实际生产中助焊剂的选择与使用.
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| 关 键 词： | 电子组装 无铅化 助焊剂选择 |
Choice of Flux in Electronic Assembly |
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| SHI Jian-wei,XU Yuan,WANG Jian-bin,LIANG Quan.Choice of Flux in Electronic Assembly[J].Electronics Process Technology,2009,30(3). |
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| Authors: | SHI Jian-wei XU Yuan WANG Jian-bin LIANG Quan |
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| Affiliation: | 1.Sun East Electronic Technology Company Ltd;Shenzhen 518103;China;2.Darbond Technology Company Ltd;Yantai 264006;China |
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| Abstract: | The flux is one of the important materials in electronic assembly,which get rid of oxide and contamination of surface for solder materials in order to shape good solder joints by wetting between solder and solder pad.Introduce the function and components,kinds and performance,work styles and process assess of flux,and help to choice and use of flux in practice. |
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| Keywords: | Electronic assembly Lead-free Flux choice |
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