| 常温静电封接技术的研究与实验尝试 |
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| 引用本文： | 孔德义 余兵. 常温静电封接技术的研究与实验尝试[J]. 传感器与微系统, 1995, 0(4): 10-12 |
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| 作者姓名： | 孔德义 余兵 |
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| 作者单位： | 中科院合肥智能机械研究所 |
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| 摘 要： | 根据静电封接的机理，配制了一种低温玻璃作为封接材料，初步完成了常温下的静电封接实验。
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| 关 键 词： | 静电封接 |
The Research and Experiment of Room Temperature Anodic Bonding |
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| Kong Deyi, Yu Bing, Mei Tao, Yu Chenduan. The Research and Experiment of Room Temperature Anodic Bonding[J]. Transducer and Microsystem Technology, 1995, 0(4): 10-12 |
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| Authors: | Kong Deyi Yu Bing Mei Tao Yu Chenduan |
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| Affiliation: | Herei Institute of Intelligent Machines |
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| Abstract: | According to the mechanism of anodic bonding, we made a kind of low melting point glass for bonding material, and have preliminarily finished room temperature anodic bonding experiment. |
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| Keywords: | Anodic bonding |
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