| 简论SMT技术 |
| |
| 引用本文： | 余建. 简论SMT技术[J]. 常州信息职业技术学院学报, 2011, 10(1): 23-26 |
| |
| 作者姓名： | 余建 |
| |
| 作者单位： | 常州信息职业技术学院电子与电气工程学院; |
| |
| 摘 要： | SMT是目前电子产品装配的主要技术,它具有高密度、高可靠、低成本、小型化和生产自动化等优点,已取代了传统的插装装配方式。简要介绍SMT的主要工艺流程及相关设备,对SMT初学者及技术人员具有一定的指导作用。
|
| 关 键 词： | SMT 插装 高密度 小型化 |
On SMT Technology |
| |
| YU Jian. On SMT Technology[J]. Journal of Changzhou Vocational College of Information Technology, 2011, 10(1): 23-26 |
| |
| Authors: | YU Jian |
| |
| Affiliation: | YU Jian(School of Electronic and Electrical Engineering,Changzhou College of Information Technology,Changzhou 213164,China) |
| |
| Abstract: | Now SMT is the most widely used technology in electronic product assembling.It has the advantages of high density,high reliability,low cost,miniaturization and automation.And it has replaced the traditional THC technology.The article briefly introduces the main process flow and related devices of SMT.It is useful to the SMT beginners and technical staff. |
| |
| Keywords: | SMT THC high density miniaturization |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ |
|
