电路板锡膏均匀性参数检测系统

建构了电路板锡膏的三维测量系统，实现了印刷锡膏均匀性参数的获取，从而达到对表面贴装质量进行监控和评价的目的．该系统基于线结构光测量原理，借助扫描技术实现三维轮廓测量．利用Tsai的径向排列约束法标定摄像机参数，由特制的棱角标定块实现光平面参数的标定．提出了电路板基层面自动确定方法，即根据图像特性实现锡膏和基层面的分离；并采用主元素分析法进行平面拟合，实现锡膏均匀性参数的计算和统计．采用该实验设备在半导体生产线上进行了大量测量，实验结果表明该系统操作简单、稳定可靠．

Inspection System for the Uniformity Parameters of Solder Paste

A 3D measurement system of the solder paste was established.The uniformity parameters of solder paste can be extracted by this system, which is competent for the quality control of surface mount technology（SMT） product line.The structured-light measurement theory is applied to this system; in addition, the whole profile of solder paste can be obtained by the light scanning technique.The internal parameters of CCD camera are obtained by the radial alignment constraint （RAC） method of Tsai.And the light plane parameters are calibrated with one special multi-arris block.The automatic method of base-plane definition was proposed.The base-plane data are decomposed with the image gray feature, and fitted by princi- pal components analysis （PCA）algorithm.According to this method,the uniformity parameters are obtained and ana- lyzed.Experimental results at the product line prove that the system is a more easily operated device with high performance.