| 聚乙烯亚胺添加剂对碱性镀铜电沉积行为的影响 |
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| 引用本文： | 占稳,胡立新,张智,欧阳贵,程骄,陈雪梅.聚乙烯亚胺添加剂对碱性镀铜电沉积行为的影响[J].材料保护,2010,43(2). |
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| 作者姓名： | 占稳 胡立新 张智 欧阳贵 程骄 陈雪梅 |
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| 作者单位： | 湖北工业大学化学与环境工程学院,湖北,武汉,430068;武汉材料保护研究所,湖北,武汉,430030;黄石理工学院化工与材料学院,湖北,黄石,435003 |
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| 基金项目： | 湖北省教育厅科学研究计划重点项目 |
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| 摘 要： | 为了研究碱性镀铜中添加剂对铜电沉积行为的影响,采用一种新型柠檬酸碱性镀铜工艺制备了铜镀层,研究了聚乙烯亚胺添加剂在新型柠檬酸盐碱性镀铜中的作用机理.运用SEM,XRD和电化学方法对镀液、镀层进行了分析.结果表明:聚乙烯亚胺有利于获得较宽的电流密度范围和均匀细致的镀层,使铜镀层表现出(111)晶面的择优取向,铜的沉积为侧向生长;聚乙烯亚胺优先吸附在阴极高电流密度处,并对铜沉积产生较强的阻化作用;铜电沉积的初期行为服从扩散控制和三维连续成核方式生长规律.
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| 关 键 词： | 碱性镀铜 聚乙烯亚胺添加剂 镀层表面形貌 择优取向 连续成核 |
Effect of Polvethyleneimine on Electrodeposition Behavior of Copper in an Alkaline Bath |
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| ZHAN Wen,HU Li-xin,ZHANG Zhi,OUYANG Gui,CHENG Jiao,CHEN Xue-mei.Effect of Polvethyleneimine on Electrodeposition Behavior of Copper in an Alkaline Bath[J].Journal of Materials Protection,2010,43(2). |
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| Authors: | ZHAN Wen HU Li-xin ZHANG Zhi OUYANG Gui CHENG Jiao CHEN Xue-mei |
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| Affiliation: | ZHAN Wen1,HU Li-xin1,ZHANG Zhi1,OUYANG Gui2,CHENG Jiao1,CHEN Xue-mei3 (1.School of Chemical , En-vironmental Engineering,Hubei Polytechnic University,Wuhan430068,China,2.Wuhan Research Institute of Materials Pro-tection,Wuhan430030,3.Department of Chemical Engi-neering , Materials,Huangshi Institute of Technology,Huang-shi 435003,China) |
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| Abstract: | Cu coating was prepared by using a novel copper electro-plating technology in an alkaline bath containing citric acid,andthe action mechanism of polvethyleneimine additive was investiga-ted.The morphology and microstructure of the Cu coating wereanalyzed by means of scanning electron microscopy and X-ray dif-fraction.At the same time,the adsorption behavior of polyethyle-neimine additive was evaluated by using cyclic voltammetry,andthe electrodeposition behavior of Cu was examined by means ofchronoamperomet... |
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| Keywords: | alkaline copper electroplating polyethyleneimine additive surface morphology orientation continuous nucleation |
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