Whisker growth on surface treatment in the pure tin plating |
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Authors: | Kyung-Seob Kim Wan-Ok Han Sung-Won Han |
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Affiliation: | (1) Department of Electronic Engineering, Yeojoo Institute of Technology, 469-705 Yeojoo, Korea;(2) Department of Mechanical Engineering, Chung-Ang University, 156-756 Seoul, Korea |
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Abstract: | Whisker behavior at various surface treatment conditions of pure Sn plating are presented. The temperature cycling test for
600 cycles and the ambient storage for 1 year was performed, respectively. From the temperature cycling test, bent-shaped
whiskers were observed on matte and semibright Sn plating, and flower-shaped whisker on bright Sn plating. The bright Sn plating
has smaller whiskers than the other types of Sn plating, and the whisker growth density per unit area is also lower than the
others. After 1 year under ambient storage, nodule growth of FeNi42 lead frame (LF) was observed in some parts. The Cu LF
showed about a 9.0 μm hillock-shaped whisker. This result demonstrated that the main determinant of whisker growth was the
number of temperature cycling (TC) in the FeNi42 LF, whereas it was the time and temperature in the Cu LF. Also, whisker growth
and shape varied with the type of surface treatment and grain size of plating. |
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Keywords: | Tin whisker lead free temperature cycling (TC) ambient storage leadframe (LF) |
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