|
|||||
|
|
Effects of rare earth Ce addition on the microstructure,wettability and interfacial reactions of eutectic Sn–0.7Cu solder |
|
| Authors: | N Zhao M L Huang Y Zhong H T Ma X M Pan |
| Affiliation: | 1. Electronic Packaging Materials Laboratory, School of Materials Science and Engineering, Dalian University of Technology, Dalian, 116085, China |
| Abstract: | |
| Keywords: | |
| 本文献已被 SpringerLink 等数据库收录！ | |
