| 两种无铅钎料的抗蠕变性能与Sn60Pb40钎料的对比分析 |
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| 引用本文： | 张新平,于传宝,张宇鹏,朱敏.两种无铅钎料的抗蠕变性能与Sn60Pb40钎料的对比分析[J].焊接学报,2007,28(2):1-4. |
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| 作者姓名： | 张新平 于传宝 张宇鹏 朱敏 |
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| 作者单位： | 华南理工大学,机械工程学院,广州,510640;华南理工大学,机械工程学院,广州,510640;华南理工大学,机械工程学院,广州,510640;华南理工大学,机械工程学院,广州,510640 |
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| 基金项目： | 国家自然科学基金
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教育部跨世纪优秀人才培养计划 |
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| 摘 要： | 对两种无铅钎料Sn-Ag-Cu-Bi和Sn-Ag-Sb模拟封装钎焊接头的蠕变和断裂行为进行了研究,并与传统的Sn60Pb40近共晶钎料进行了对比.结果表明,两种无铅钎料的抗蠕变能力均远优于Sn60Pb40近共晶钎料,其蠕变速率低且蠕变寿命长.钎焊接头蠕变断裂后的扫描电镜分析表明,两种无铅钎料钎焊接头的蠕变断裂呈现明显的沿晶断裂特征,而Sn60Pb40钎料钎焊接头的蠕变断裂机理则为穿晶断裂.
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| 关 键 词： | 无铅钎料 蠕变行为 力学性能 穿晶断裂 沿晶断裂 |
| 文章编号： | 0253-360X（2007）02-000-04 |
| 收稿时间： | 2006/1/24 0:00:00 |
| 修稿时间： | 2006-01-24 |
Creep-resistant performance of two lead-free solders and comparison with Sn60Pb40 solder |
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| ZHANG Xinping,YU Chuanbao,ZHANG Yupeng and ZHU Min.Creep-resistant performance of two lead-free solders and comparison with Sn60Pb40 solder[J].Transactions of The China Welding Institution,2007,28(2):1-4. |
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| Authors: | ZHANG Xinping YU Chuanbao ZHANG Yupeng and ZHU Min |
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| Affiliation: | School of Mechanical Engineering, South China University of Technology, Guangzhou 510640, China,School of Mechanical Engineering, South China University of Technology, Guangzhou 510640, China,School of Mechanical Engineering, South China University of Technology, Guangzhou 510640, China and School of Mechanical Engineering, South China University of Technology, Guangzhou 510640, China |
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| Abstract: | The creep and fracture behaviors of the joints soldered by two lead-free solders,Sn-Ag-Cu-Bi and Sn-Ag-Sb,were studied,and a comparison to the traditional Sn60Pb40 solder was also researched.The results show that the two lead-free solders have much better creep resistant performance than that of the Sn60Pb40 solder,in terms of longer creep rupture lifetime and lower creep rate.The SEM inspection and analysis of the creep fractured joints show that creep fracture of the joints soldered by two lead-free solders presents obviously intergranular fracture mechanism,while creep fracture of the Sn60Pb40 soldered joint presents dominantly transgranular sliding. |
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| Keywords: | lead-free solder creep behavior mechanical properties transgranular fracture intergranular fracture |
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