| 不同钎料对QFP焊点可靠性影响的有限元分析 |
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| 引用本文： | 张亮,薛松柏,卢方焱,韩宗杰. 不同钎料对QFP焊点可靠性影响的有限元分析[J]. 焊接学报, 2007, 28(10): 45-48, 52 |
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| 作者姓名： | 张亮 薛松柏 卢方焱 韩宗杰 |
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| 作者单位： | 南京航空航天大学,材料科学与技术学院,南京,210016 |
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| 基金项目： | 江苏省六大人才高峰基金 |
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| 摘 要： | 采用有限元方法研究了不同钎料钎焊QFP器件焊点的可靠性.结果表明,焊点根部、焊趾部位以及引线和焊点交界处为应变集中区域.分析探讨了Sn3.8Ag0.7Cu,Sn9Zn,Sn63Pb37三种钎料的模拟结果,焊点的应变曲线图显示,Sn63Pb37钎料焊点的等效应变最大,Sn9Zn钎料居中,Sn3.8Ag0.7Cu焊点的等效应变最小,表明Sn3.8Ag0.7Cu替代Sn63Pb37作为微元器件组装的组装材料具有更好的焊点力学性能.通过分析QFP64和QFP208两种器件焊点应力曲线图可以看出,QFP208器件焊点的应力值小于QFP64器件焊点的应力值,从而具有更高的可靠性.
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| 关 键 词： | 有限元方法 可靠性 微元器件 应力曲线图 |
| 文章编号： | 0253-360X（2007）10-045-05 |
| 收稿时间： | 2007-04-24 |
| 修稿时间： | 2007-04-24 |
Finite element analysis on soldered joint reliability of QFP device with different solders |
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| ZHANG Liang,XUE Songbai,LU Fangyan and HAN Zongjie. Finite element analysis on soldered joint reliability of QFP device with different solders[J]. Transactions of The China Welding Institution, 2007, 28(10): 45-48, 52 |
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| Authors: | ZHANG Liang XUE Songbai LU Fangyan HAN Zongjie |
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| Affiliation: | College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China,College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China,College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China and College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China |
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| Abstract: | Finite element method was used to study the reliability of soldered joints of QFP device with three kinds of solders. The results indicate that the strain concentration areas in soldered joint locates at the heel and toe of the soldered joint and the area between the lead and soldered joint.Comparing with the simulating results about Sn3.8Ag0.7Cu, Sn9Zn and Sn63Pb37, from the diagrams of equivalent stress curves, it is found that the stress value in the soldered joint with Sn63Pb37 solder is the largest, and the value in the joint with Sn3.8Ag0.7Cu solder is the least.Sn3.8Ag0.7Cu is considered one of the most favorable solder as a lead-free standard alloy for packaging of micro-devices.By analyzing stress diagrams of curves of solder of the two kinds of QFP64 and QFP208 devices, the stress of solder of QFP208 is lower than that of QFP64, so its reliability is better. |
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| Keywords: | finite element method reliability micro-devices stress diagrams |
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