TO系列塑料封装离层探讨

文章研究了TO系列塑料封装功率器件产品产生离层的原因。同时,研究了TO系列塑料封装功率器件产品在上芯、压焊、塑封工序中的原材料、塑封模具、工艺参数等对离层的影响,并通过SAT图片,对影响离层的因素进行了论证,提出了如何预防或减轻TO系列塑料封装产品离层的产生。实验结果表明:塑封工艺参数的合理选择、塑封模具结构的合理选用、塑封料优选对TO系列塑料封装离层有较好的改善作用,并且在塑封生产线上易于实现。文章在这些方面做了相关尝试,取得了较好的效果。

Preventing Layered Technology in TO Plastic Packaging

The paper studies the reasons of delamination happening to the package of TO series of power devices. At the same time, the thesis also studies the influence of raw material, molding die, process parameters and so on to the delamination. Through SAT photos, the factors causing delamination are expounded. The thesis puts forward the method how the delamination happening to the package of TO series of power devices can be prevented and alleviated. The experiment result shows that with reasonable process parameters and structure of molding die and superior mold compound, the improvement of delamination can be better. What＇s more, the improvement can be available to the production line. The thesis records the relevant trials and achieves preferable effect.