| 导热高分子材料的研究新进展 |
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| 引用本文： | 杜茂平,魏伯荣.导热高分子材料的研究新进展[J].塑料工业,2007,35(B06):54-57,73. |
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| 作者姓名： | 杜茂平 魏伯荣 |
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| 作者单位： | 西北工业大学高分子研究所,陕西西安710072 |
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| 摘 要： | 总述了导热高分子材料的典型理论模型和导热机理；并对国内外导热高分子材料的研究开发现状作了详细介绍；最后提出了导热高分子材料综合性能提高的途径。
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| 关 键 词： | 导热机理 导热理论模型 导热填料 热导率 |
Recent Advance in Research on Thermal Conductive Polymer Material |
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| DU Mao-ping, WEI Bo-rong.Recent Advance in Research on Thermal Conductive Polymer Material[J].China Plastics Industry,2007,35(B06):54-57,73. |
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| Authors: | DU Mao-ping WEI Bo-rong |
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| Abstract: | The typical theory model and heat conduction mechanism of thermal conductive polymer material are summarized. Meanwhile, the development of polymer materials both at home and abroad are introduced in detail. At last, the approaches of improving the general properties of the thermal conductive polymer materials are also raised. |
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| Keywords: | Heat Conduction Mechanism Thermal Conducting Theory Model Thermal Conducting Filler Heat Conductivity |
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