| 太阳电池用Si片切割过程中浆料作用研究 |
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| 引用本文： | 贺敬良,王学军,童亮,董和媛.太阳电池用Si片切割过程中浆料作用研究[J].半导体技术,2010,35(10):976-979. |
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| 作者姓名： | 贺敬良 王学军 童亮 董和媛 |
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| 作者单位： | 北京信息科技大学,机电工程学院,北京,100192;北京信息科技大学,机电工程学院,北京,100192;中国电子科技集团公司,第四十五研究所,北京,101601 |
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| 基金项目： | 北京市教育委员会科技发展计划项目 |
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| 摘 要： | Si片生产技术及工艺的进步使得太阳电池用Si片的切片厚度不断降低,而超薄的太阳电池用Si片必须通过多线切割机进行切割.基于Si片切割过程中砂浆性能对Si片表面质量、Si片成片率和切割线寿命的影响,分析了多线切割机中切削液的性能,并采用不同工艺参数多次进行试验,总结出了砂浆对太阳电池用Si片切割状态的影响因素.通过分析,得出了改善砂浆性能来提高多线切割机切片性能并获得更高的Si晶片表面质量的方法.
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| 关 键 词： | 多线锯 切削液 砂浆 硅片 太阳电池 |
Research on Slurry in the Cutting Process of Si Wafer for Solar Cell |
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| He Jingliang,Wang Xuejun,Tong Liang,Dong Heyuan.Research on Slurry in the Cutting Process of Si Wafer for Solar Cell[J].Semiconductor Technology,2010,35(10):976-979. |
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| Authors: | He Jingliang Wang Xuejun Tong Liang Dong Heyuan |
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| Affiliation: | He Jingliang1,Wang Xuejun1,2,Tong Liang1,Dong Heyuan1(1.School of Mechanical and Electrical Engineering,Beijing Information Science & Technology University,Beijing 100192,China,2.The 45th Research Institute,CETC,Beijing 101601,China) |
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| Abstract: | The wafer production technology and process make the solar energy wafer thickness become thinner and thinner.The ultrathin Si wafer cutting must be done by multi-wire saw.Based on the effects of slurry performance on the wafer surface quality,yields and cutting wire life in the cutting process of Si ingot,the multi-wire saw slurry performance was analyzed,and experiments were carried out with different parameters to test the infection of cutting slurry for wafer cutting states.By analyzing the infection fac... |
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| Keywords: | multi-wire saw cutting fluid slurry Si wafer solar cell |
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