导电银胶触变性的研究

以环氧树脂为基体,银粉为填料,制备出IC封装用导电银胶。研究了环氧树脂与银粉的比例、银粉的形貌和粒径以及触变剂SiO2的用量对导电银胶触变性的影响。结果表明,银胶触变性随树脂/银粉质量比的减小而增大,当其为0.2时,触变指数达到5.68。在一定粒径范围内,银胶的触变性与银粉粒径呈反比关系;银胶触变性随SiO2的用量增大而增大。

Study on the thixotropy of conductive silver adhesive

Using epoxy resin as matrix and silver powders as fillers,the conductive silver adhesive used for IC packaging was prepared.Effects of the mass ratio of epoxy resin to silver powder,silver powders' shapes,specific surface areas,grain sizes and quantity of thixotropic agent SiO2 on the thixotropy of the conductive silver adhesive were studied.The results show that the conductive silver adhesive's thixotropy gradually increases when the mass ratio of epoxy resin to silver powder reduces.When the mass radio is 0.2,the thixotropy exponent reaches 5.68.The silver adhesive's thixotropy and particle size is inverse relation within a certain particle size range,and the silver adhesive's thixotropy increases with the increment of the amount of SiO2.