A study of the effect of tool cutting edge radius on ductile cutting of silicon wafers |
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Authors: | K Liu X P Li M Rahman K S Neo X D Liu |
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Affiliation: | (1) Department of Mechanical Engineering, National University of Singapore, 10 Kent Ridge Crescent, Singapore, 119260, Singapore;(2) Machining Technology Group, Singapore Institute of Manufacturing Technology, 71 Nanyang Drive, Singapore, 638075, Singapore |
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Abstract: | Ductile mode cutting of silicon wafers can be achieved under certain cutting conditions and tool geometry. An experimental
investigation of the critical undeformed chip thickness in relation to the tool cutting edge radius for the brittle-ductile
transition of chip formation in cutting of silicon wafers is presented in this paper. Experimental tests for cutting of silicon
wafers using diamond tools of different cutting edge radii for a range of undeformed chip thickness are conducted on an ultra-precision
lathe. Both ductile and brittle mode of chip formation processes are observed in the cutting tests. The results indicate that
ductile cutting of silicon can be achieved at certain values of the undeformed chip thickness, which depends on the tool cutting
edge radius. It is found that in cutting of silicon wafers with a certain tool cutting edge radius there is a critical value
of undeformed chip thickness beyond which the chip formation changes from ductile mode to brittle mode. The ductile-brittle
transition of chip formation varies with the tool cutting edge radius. Within the range of cutting conditions in the present
study, it has also been found that the larger the cutting edge radius, the larger the critical undeformed chip thickness for
the ductile-brittle transition in the chip formation. |
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Keywords: | Edge radius Diamond tool Silicon wafer Ductile cutting |
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