Brazing of pressureless-sintered SiC using Ag-Cu-Ti alloy

A pressureless-sintered SiC was brazed to itself using Ag-Cu alloy foil to which titanium had been added. The results obtained revealed the following. (i) Increasing the titanium addition to the base metal from 2 to 8 wt % improved the wettability greatly, but the bonding generally became weaker. (ii) With 2 wt % Ti addition, a reaction layer about 1 m thick was formed, regardless of which brazing temperature was used, while bond strength reached was over linearly with temperature. The maximum room-temperature bend strength reached was over 350 MPa. (iii) In the case of the alloy with only 2 wt % Ti additive, bonding was greatly influenced not only by improvement of the wettability at high temperatures and longer holding times, but also the composition and thickness of the resultant reaction layer.