Overview on fabrication of three-dimensional structures in multi-layer ceramic substrate |
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| Authors: | LE Khoong YM Tan YC Lam |
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| Affiliation: | 1. Singapore Institute of Manufacturing Technology, 71 Nanyang Drive, Singapore 638075, Singapore;2. Nanyang Technological University, 50 Nanyang Avenue, Singapore 639798, Singapore;1. School of Mechanical Science and Engineering, Huazhong University of Science and Technology, Wuhan, 430074, China;2. State Key Laboratory of Digital Manufacturing Equipment and Technology, Huazhong University of Science and Technology, Wuhan, 430074, China;3. Wuhan National Laboratory for Optoelectronics, Huazhong University of Science and Technology, Wuhan, 430074, China;1. State Key Laboratory of Electronic Thin Films and Integrated Devices, School of Electronic Science and Engineering, University of Electronic Science and Technology of China, Chengdu, 610054, China;2. School of Materials and Energy, National Engineering Research Center of Electromagnetic Radiation Control Materials, Center for Applied Chemistry, University of Electronic Science and Technology of China, Chengdu, 610054, China;3. College of Electrical and Information Engineering, Hunan University, Changsha, 410082, China |
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| Abstract: | Three-dimensional structures in a multi-layer ceramic substrate are important in realizing ceramic-based meso- and micro-systems. During lamination and/or co-firing, three-dimensional structures, especially those with suspended structures, tend to deform and sag due to the intrinsic nature of the green (un-fired) ceramic material. Fabrication of three-dimensional structures with well-controlled dimensional stability and mechanical integrity remains a challenge. This paper discusses the challenges in fabricating structures in a multi-layer ceramic substrate. An overview is provided of the current state of the art in patterning and lamination techniques for the fabrication of these three-dimensional structures. |
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