| CMP抛光机抛光台温度控制的研究 |
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| 引用本文： | 王伟,王东辉,李伟.CMP抛光机抛光台温度控制的研究[J].电子工业专用设备,2011,40(10):24-28. |
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| 作者姓名： | 王伟 王东辉 李伟 |
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| 作者单位： | 中国电子科技集团公司第四十五研究所,北京东燕郊,101601 |
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| 摘 要： | 阐述了CMP抛光机抛光台的温度控制方法。用有限元软件ANSYS模拟了抛光台和循环水的热交换过程,并且分析循环水的流量和温度对热交换效率的影响,得出循环水流量和温度跟热交换效率的关系。根据它们之间的关系,设计了一种CMP抛光机抛光台温度控制系统和方法,通过有限元软件ANSYS模拟了该温度控制系统和方法的控制过程,模拟结果...
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| 关 键 词： | 化学机械抛光 抛光台 温度控制 |
Study on Temperature Control Technology of CMP Polish Table |
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| WANG Wei,WANG Donghui,LI Wei.Study on Temperature Control Technology of CMP Polish Table[J].Equipment for Electronic Products Marufacturing,2011,40(10):24-28. |
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| Authors: | WANG Wei WANG Donghui LI Wei |
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| Affiliation: | (The 45th Research Institute of CETC,Beijing 101601,China,) |
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| Abstract: | This paper introduces the temperature control system for the polish table in Chemical Mechanical Polishing（CMP） equipment.By the finite element software ANSYS,the heat-exchange process between polishing table and circulating water is analyzed,and also the relation between the flow and temperature of water and the polishing table＇s temperature is studied.Based on the analyses result,the article designs a kind of temperature control system for polish table.And simulate the process of temperature control used the ansys software.The simulated result shows by this quick,accurate and stable temperature control system,polishing table temperature is under control.So this system meets the requirements of CMP polishing process. |
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| Keywords: | Chemical mechanical polishing Polish table Temperature control |
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