| 正性光敏聚酰亚胺研究与应用进展（二） |
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| 引用本文： | 刘金刚,袁向文,尹志华,左立辉,杨士勇.正性光敏聚酰亚胺研究与应用进展（二）[J].电子与封装,2009,9(1):7-11,23. |
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| 作者姓名： | 刘金刚 袁向文 尹志华 左立辉 杨士勇 |
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| 作者单位： | 1. 高技术材料实验室,中国科学院化学研究所,北京,100080
2. 北京波米科技有限公司,北京,100044 |
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| 摘 要： | 正性光敏聚酰亚胺（p—PSPI）是一类重要的集成电路（IC）封装材料，广泛用于IC器件的应力缓冲、表面钝化以及层间绝缘。与传统的负性光敏聚酰亚胺（n-PSPI）相比，p-PSPI无论在光刻精度还是环境友好性方面均表现出了更为优良的品质。文章综述了国内外p-PSPI电子封装材料的最新研究与应用进展状况。系统阐述了p-PSPI的光化学机理。对目前商业化p-PSPI产品的特性、在微电子以及光电子领域的应用和未来发展趋势进行了介绍。最后对国内高性能p-PSPI电子材料的研发工作提出了建议。
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| 关 键 词： | 正性光敏聚酰亚胺 光刻 微电子封装 光电器件 |
Research and Development of Positive-working Photosensitive Polyimides(2) |
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| LIU Jin-gang,YUAN Xiang-wen,YIN Zhi-hua,ZUO Li-hui,YANG Shi-yong.Research and Development of Positive-working Photosensitive Polyimides(2)[J].Electronics & Packaging,2009,9(1):7-11,23. |
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| Authors: | LIU Jin-gang YUAN Xiang-wen YIN Zhi-hua ZUO Li-hui YANG Shi-yong |
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| Affiliation: | LIU Jin-gang1,YUAN Xiang-wen2,YIN Zhi-hua1,ZUO Li-hui2,YANG Shi-yong1 (1. Institute of Chemistry,Chinese Academy of Sciences,Beijing 100080,China,2. Beijing POME Sci-tech Co. Ltd,Beijing 100044,China) |
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| Abstract: | Positive-working photosensitive polyimides(p-PSPIs)are a type of important integrated circuit(IC)packaging materials and have been widely utilized as the stress buffer coating, passivation layer, and interlayer dielectrics for IC devices. p-PSPIs exhibit higher photosensitivity and better environmental compatibility compared with negative PSPIs(n-PSPIs). The recent research and development of p-PSPIs have been summarized in this paper. The photochemical reaction mechanisms of p-PSPIs were presented. The cha... |
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| Keywords: | positive-working photosensitive polyimides photolithography microelectronic packaging optoelectronic devices |
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