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Single Crystal Si Layers on Glass Fabricated by Hydrophilic Fusion Bonding and Smart-Cut Technology
作者姓名:甄万宝  刘卫丽  宋志棠  封松林  朱世富  赵北君
作者单位:[1]TheResearchCentreofSemiconductorFunctionalFilmEngineeringTechnology,ShanghaiInstituteofMicrosystemandInformationTechnology,ChineseAcademyofSciences,Shanghai200050 [2]TheResearchCentreofSemiconductorFunctionalFilmEngineeringTechnology,ShanghaiInstituteofMicrosystemandInformationTechnology,ChineseAcademyofSciences,Shanghai200050 [3]DepartmentofMaterialsScienceandEngineering,SichuanUniversity,Chendu610064
摘    要:A single crystal Si thin film on a glass substrate has been obtained successfully by hydrophilic fusion bonding and the smart-cut technology. Tensile strength testing shows that the bonded interface has strong adhesion and the bonding strength is about 8.7MPa. Crystallinity and microstructure of the samples have been characterized by transmission electron microscopy (TEM). Electrical properties have also been investigated by Hall measurements and four-point probe. The mobility of the transferred Si layer on glass is about 122cm^2//V.s. The results show that the single-crystal silicon layer transferred onto glass by direct bonding keeps good quality for the applications of integrated circuits, transducers, and fiat panel display.

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Single Crystal Si Layers on Glass Fabricated by Hydrophilic Fusion Bonding and Smart-Cut Technology
ZHEN Wan-Bao,LIU Wei-Li,SONG Zhi-Tang,FENG Song-Lin,ZHU Shi-Fu,ZHAO Bei-Jun.Single Crystal Si Layers on Glass Fabricated by Hydrophilic Fusion Bonding and Smart-Cut Technology[J].Chinese Physics Letters,2004,21(12):2540-2542.
Authors:ZHEN Wan-Bao  LIU Wei-Li  SONG Zhi-Tang  FENG Song-Lin  ZHU Shi-Fu  ZHAO Bei-Jun
Affiliation:The Research Centre of Semiconductor Functional Film Engineering Technology, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai 200050 Department of Materials Science and Engineering, Sichuan University, Chendu 610064
Abstract:A single crystal Si thin film on a glass substrate has been obtained successfully by hydrophilic fusion bonding and the smart-cut technology. Tensile strength testing shows that the bonded interface has strong adhesion and the bonding strength is about 8.7MPa. Crystallinity and microstructure of the samples have been characterized by transmission electron microscopy (TEM). Electrical properties have also been investigated by Hall measurements and four-point probe. The mobility of the transferred Si layer on glass is about 122cm2/V.s. The results show that the single-crystal silicon layer transferred onto glass by direct bonding keeps good quality for the applications of integrated circuits, transducers, and flat panel display.
Keywords:81  05  -t  73  61  Cw
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