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发射组件强迫风冷系统的热设计
引用本文:李勤建,高翠琢,边国辉.发射组件强迫风冷系统的热设计[J].半导体技术,2012,37(9):730-733.
作者姓名:李勤建  高翠琢  边国辉
作者单位:中国电子科技集团公司第十三研究所,石家庄,050051;中国电子科技集团公司第十三研究所,石家庄,050051;中国电子科技集团公司第十三研究所,石家庄,050051
摘    要:论述了发射组件强迫风冷系统的热设计方法,介绍了强迫风冷体积流量的理论估算。用ICEPAK CFD热分析软件进行热仿真,包括建模、加载边界条件、检查结果等。在仿真时根据最高温度、风扇的工作点、出风口和入风口的温度差,对翅片的厚度、齿间距进行优化,模块产生的热量通过流过散热器翅片间的强迫流动的空气散发出去,最终满足发射组件热设计的要求。元器件工作在允许的温度范围内,确保发射模块正常工作。测试数据与仿真数据基本符合表明热仿真的正确性。

关 键 词:温度  风冷  风扇  散热器  仿真

Thermal Design of Forced Air-Cooling System on Transmitter Module
Li Qinjian,Gao Cuizhuo,Bian Guohui.Thermal Design of Forced Air-Cooling System on Transmitter Module[J].Semiconductor Technology,2012,37(9):730-733.
Authors:Li Qinjian  Gao Cuizhuo  Bian Guohui
Affiliation:(The 13th Research Institute,CETC,Shijiazhuang 050051,China)
Abstract:Thermal design methods of the forced air-cooling system on the transmitter module were presented.The volume flux of the forced air-cooling convection can be computed by classical formula.The thermal simulation was carried out by the ICEPAK computational hluid dynamic software,including model,load and inspecting solution.The fin thickness and distance were optimized according to the maximurn temperature,work point of fan and temperature difference between inlet and outlet.The transmitter module heat exchanges with forced air via a plate-finned heat sink,and finally meets the requirements of the thermal design launch components.Devices in module was operated in the normal temperature range so that it worked well.It shows that the results of thermal simulations accord with the experimental data.
Keywords:temperature  air-cooling  fan  heat sink  simulation
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