半导体激光抽运源大通道水冷热沉的接口设计

针对普通大功率半导体激光抽运源用大通道水冷热沉热阻高、工作时热沉表面在大通道水流方向存在明显温升进而导致加载其上的激光bar寿命不一致以及抽运源整体光谱宽度难以控制的问题,利用商用有限元软件ANSYS仿真获得抽运源工作时不同冷却水流量条件下热沉内部温度场分布,分析该结构热沉热阻系统的构成及整体热阻瓶颈所在。实际中通过改变冷却水接口结构,获得“入口效应”,提高了大通道热沉整体换热性能,进一步减小热沉表面温度梯度。利用所设计的新接口大通道水冷热沉获得3 bar线阵120 W连续(CW)输出半导体激光器抽运源,输出中心波长为807.7 nm,光谱宽度(FWHM)为2.8 nm。

Normal Water Cooled Heatsink's Inlet Design of Semiconductor Laser Pumping Source

Facing the problems of high thermal resistance and high temperature difference on the top surface of semiconductor laser arrays′ directional macro-channel liquid-cooled heat sinks inducing different lifetimes and hard controlling of spectral width, the temperature distribution of internal heat sinks through the finite element modeling is presented. The heat sink under consideration is made of copper with varying the area of coolant inlet. Established analysis and simulation models show that a heat sink with smaller inlet area provides a lower surface temperature gradient and a better capability of heat dissipate. A continuous wave (CW) 120 W output semiconductor laser arrays pump source (3 laser bars) is obtained by using this kind of small inlet macro-channel heat sink. The central wavelength is 807.7 nm with a full wavelength at half maximum (FWHM) of 2.8 nm.