| 低粘度高耐热环氧树脂组成物研究 |
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| 引用本文： | 段华军,王翔,杨小利,王钧.低粘度高耐热环氧树脂组成物研究[J].热固性树脂,2005,20(1):31-33. |
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| 作者姓名： | 段华军 王翔 杨小利 王钧 |
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| 作者单位： | 武汉理工大学材料科学与工程学院,湖北,武汉,430070 |
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| 摘 要： | 在改性酸酐固化的环氧树脂体系中,加入非环氧类低粘度活性交联剂,得到了室温下粘度仅为80mPa·s的酸酐 环氧树脂体系。利用正交试验优选了树脂配方,该树脂体系在有效降低粘度的同时,还提高了耐热性,优选配方树脂体系的热变形温度达到265℃。该树脂体系适用于RTM(ResinTransferMolding)成型工艺制备高性能复合材料及电器设备的灌封。
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| 关 键 词： | 环氧树脂 酸酐 粘度 热变形温度 |
| 文章编号： | 1002-7432(2005)01-0031-03 |
| 修稿时间： | 2004年8月24日 |
STUDY ON EPOXY RESIN COMPOSITION WITH LOW VISCOSITY & EXCELLENT HEAT RESISTANT |
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| DUAN Hua-jun,WANG Xiang,YANG Xiao-li,WANG Jun.STUDY ON EPOXY RESIN COMPOSITION WITH LOW VISCOSITY & EXCELLENT HEAT RESISTANT[J].Thermosetting Resin,2005,20(1):31-33. |
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| Authors: | DUAN Hua-jun WANG Xiang YANG Xiao-li WANG Jun |
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| Abstract: | In this paper,self-made active cross-linking agent with low viscosity was added to epoxy resin system which use modified anhydride as curing agent to decrease the viscosity of the resin composition to 80 mPa·s at room temperature.After optimizing the formula and curing conditions by orthogonal test,the resin system both had low viscosity and good heat resistance.Its heat distortion temperature reached to 265 ℃。So it was suit for making high performance composite by RTM method and encapsulating resin for electronic equipments. |
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| Keywords: | epoxy resin anhydride viscosity heat distortion temperature |
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