碳纤维传动轴胶接胶层应力均匀化分析

碳纤维传动轴胶接联接在传递载荷时,会出现端部胶层应力大、中间应力小的现象,这种现象会使胶接接头的胶层首先从端部破坏,影响联接性能。从应变角度阐述胶接胶层应力曲线规律,说明了影响胶层应力分布的因素有胶层内、外周向变形量和胶层厚度,提出几种胶接胶层应力均匀化方法,并用有限元分析方法进行了验证。结果表明:(1)增加胶层厚度可以使胶层应力均匀化,但均匀化程度不明显,且在工程中会增加胶层缺陷;(2)采用变胶层厚度的鼓形结构胶接能够使胶层应力均匀化明显,最后指出影响鼓形胶接胶层应力均匀化的因素有变厚度胶层长度L、胶层的最大厚度H。

THE ANALYSIS OF HOMOGENIZING OF BOND LAYER IN THE CARBON FIBER DRIVE SHAFT

When the carbon fiber drive shaft is connected by adhesive transfers load, the stress in the end of bonding layer will be greatly enhanced while the middle part will be reduced, which causes the destruction of adhesive joint generates in the end of the bonding layer first, then affects the performance of the coupling.This article explains the adhesive bonding layer stress curve regular from the perspective of strain and puts forward several factors which influence the stress distribution of bonding layer.These factors involve internal and external circumferential deformation of bonding layer and the thickness of bonding layer.Then, we put forward several methods to homogenize the bonding layer stress, which were verified by the finite element analysis method.Firstly, increasing the bonding layer thickness can homogenize the stress while the degree of homogenizing is not obvious, and it will increase the bonding layer defects in engineering.Secondly, the drum-shaped adhesion with variable thickness bonding layer makes the stress homogenization of the bonding layer more obvious.At last, this article indicates several factors that affect the stress homogenizing of the drum-shaped adhesive bonding layer such as the length of variable thickness bonding layer (L) and the maximum thickness of bonding layer (H).