| 单面板印制的几个技术难点及对策 |
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| 引用本文： | 许秀恋.单面板印制的几个技术难点及对策[J].印制电路信息,2010(5):42-45. |
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| 作者姓名： | 许秀恋 |
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| 作者单位： | 福州瑞华印制线路板有限公司,福建,福州,350002 |
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| 摘 要： | 消费类电子产品需要大量的纸质单面板，因为Ic集成度的提高和表面贴片件的小型化，制作难度越来越高。文章介绍了当前单面板存在的几个技术难点和相应采取的对策。
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| 关 键 词： | 网版张力 印刷形变 阻焊起泡 厚铜印刷 |
Single Sided PCB Technical Issues and Solutions |
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| XU Xiu-lian.Single Sided PCB Technical Issues and Solutions[J].Printed Circuit Information,2010(5):42-45. |
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| Authors: | XU Xiu-lian |
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| Affiliation: | XU Xiu-lian |
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| Abstract: | Electronics products in consuming needs a lot of paper single side printed circuit board. Because of the improvement of integration of IC and miniaturization of small pieces in surface, it becomes more and more difficult to make. This paper describes some technical diffi culty and relative solution of singe side printed circuit board nowadays. |
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| Keywords: | screen tension printing deformation solder blister thick copper printing |
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