| 陶瓷外壳质量对CBGA植球工艺质量的影响 |
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| 引用本文： | 黄颖卓,林鹏荣,练滨浩,姚全斌,曹玉生.陶瓷外壳质量对CBGA植球工艺质量的影响[J].电子工艺技术,2012(4):202-204,245. |
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| 作者姓名： | 黄颖卓 林鹏荣 练滨浩 姚全斌 曹玉生 |
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| 作者单位： | 北京时代民芯科技有限公司,北京100076 |
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| 摘 要： | 随着陶瓷球栅阵列(CBGA)封装形式的产品被广泛应用,对其产品植球工艺质量的可靠性和一致性的要求也越来越严格,对原材料特别是对陶瓷外壳质量的控制是影响CBGA植球工艺质量的重要因素之一。以CBGA256和CBGA500封装形式的电路产品为例,通过焊盘的共面性、位置度和陶瓷表面的平面度三个方面来研究陶瓷外壳的质量对CBGA植球工艺质量的影响。
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| 关 键 词： | 陶瓷外壳 共面性 位置度 平面度 CBGA植球 |
Influence of Quality of Ceramic Substrate on CBGA Reball Quality |
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| HUANG Ying-zhuo,LIN Peng-rong,LIAN Bin-hao,YAO Quan-bin,CAO Yu-sheng.Influence of Quality of Ceramic Substrate on CBGA Reball Quality[J].Electronics Process Technology,2012(4):202-204,245. |
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| Authors: | HUANG Ying-zhuo LIN Peng-rong LIAN Bin-hao YAO Quan-bin CAO Yu-sheng |
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| Affiliation: | (Beijing MXTronics Corporation,Beijing 100076,China) |
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| Abstract: | With the widespread use of Ceramic Ball Grid Array packaging products,the demand for the reliability and consistency of CBGA reball quality became stricter,controlling the quality of raw material,especially the ceramic substrate quality,is one of the most important factor on the CBGA reball quality.Take CBGA256 and CBGA500 for example,study the influence of the quality of ceramic substrate on the CBGA reball quality from pad coplanarity,position and flatness of ceramic surface. |
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| Keywords: | Ceramic substrate Coplanarity Position Flatness CBGA reball |
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