Simplified Impedance Model for Adhesively Bonded Piezo-Impedance Transducers |
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Authors: | Suresh Bhalla Praveen Kumar Ashok Gupta Tushar K. Datta |
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Affiliation: | 1Assistant Professor, Dept. of Civil Engineering, Indian Institute of Technology Delhi, New Delhi 110 016, India (corresponding author). E-mail: sbhalla@civil.iitd.ac.in 2Engineer, Dept. Central Public Works, New Delhi 110001, India; formerly, Master of Technology Student, Dept. Civil Engineering, Indian Institute of Technology Delhi, India. E-mail: praveenk96@gmail.com 3Professor, Dept. of Civil Engineering, Indian Institute of Technology Delhi, New Delhi 110016, India. E-mail: ashokg@civil.iitd.ac.in 4Dogra Chair Professor, Dept. of Civil Engineering, Indian Institute of Technology Delhi, New Delhi 110016, India. E-mail: tkdatta@civil.iitd.ac.in
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Abstract: | The electromechanical impedance technique employs surface-bonded lead zirconate titanate piezoelectric ceramic patches as impedance transducers for structural health monitoring and nondestructive evaluation. The patches are bonded to the monitored structures using finitely thick adhesive bond layer, which introduces shear lag effect, thus invariably influencing the electromechanical admittance signatures. This paper presents a new simplified impedance model to incorporate shear lag effect into electromechanical admittance formulations, both one-dimensional and two-dimensional. This provides a closed-form analytical solution of the inverse problem, i.e. to derive the true structural impedance from the measured conductance and susceptance signatures, thus an improvement over the existing models. The influence of various parameters (associated with the bond layer) on admittance signatures is investigated using the proposed model and the results compared with existing models. The results show that the new model, which is far simpler than the existing models, models the shear lag phenomenon reasonably well besides providing direct solution of a complex inverse problem. |
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Keywords: | Elasticity Probe instruments Piezoelectricity Structural reliability Adhesives Bonding Aerospace engineering |
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