| 无铅焊膏在电子封装组装中的应用 |
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| 引用本文： | 卢维奇,陈洁萍,黄奉莲.无铅焊膏在电子封装组装中的应用[J].广州化工,2002,30(4):21-23. |
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| 作者姓名： | 卢维奇 陈洁萍 黄奉莲 |
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| 作者单位： | 佛山大学材料与精细化工研究所，广东 528000 |
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| 摘 要： | 随着人们对环境的日益重视和电子封装组装焊接技术的发展，合金焊膏的无铅化和质量的要求越来越高，开发无铅、无毒焊膏成为焊膏开发的重要方向，本文论述了几种无铅焊膏Sn-Ag系，Sn-Bi和Sn-Zn系的特点，同时，也检测和评价了一种Sn-Ag免洗焊膏，其绝缘抗阻性，抗腐蚀性，产品清洁度和产品可靠性等均符合要求。
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| 关 键 词： | 无铅焊膏 电子封装组装 应用 免清洗焊膏 |
Lead-Free Solder Paste Applied in Surface Mount Technology |
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| Lu WeiqiChen JiepingHuang Fenglian.Lead-Free Solder Paste Applied in Surface Mount Technology[J].GuangZhou Chemical Industry and Technology,2002,30(4):21-23. |
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| Authors: | Lu WeiqiChen JiepingHuang Fenglian |
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| Abstract: | The conventional tin-lead solder can't meet the demand of SMT(Suface Mount Technology) development and prohibiting surrounding pollution,anymore.In this paper,we discussed the development and the using of lead-free solder paste,which covered Sn-Ag Sn-Bi,Sn-Zn,and so on.Meanwhile,we evaluated a kind of no-clean lead-free solder paste,Sn 96.5-Ag 3.5.Its insurance and corrosion inhibition of flux are good After it was used in SMT,the electronic products connected by no-clean solder paste are clear,they are not need to clean after soldered.And their reliability is excellent |
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| Keywords: | electronic package and assemblylead-free Lead-free solder pasteno-clean solder paste |
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