拼接红外探测器技术研究

红外探测器作为空间红外预警卫星的核心部件,随着红外探测器性能的不断提升,采用更大规模,更多谱段的红外探测器焦平面阵列是未来预警用红外探测器的发展趋势。通过多芯片,多谱段集成拼接制备出线列规模更长的红外探测器,以满足红外预警卫星大视场、高分辨率以及多光谱探测的能力。本文对国内外多芯片,多谱段拼接红外探测器组件发展现状以及技术路线进行对比,对小型化拼接探测器在其他领域的使用前景展望,最后点出大尺寸拼接红外探测器研制目前存在的主要问题。

Research on splicing infrared detector

Infrared detectors are the core components of space infrared early warning satellites. With the continuous improvement of infrared detector performance,the use of larger and more spectral infrared detector focal plane array is the development trend of infrared detectors for early warning in the future. The infrared detector with longer line scale is prepared by multi chip and multi spectrum integration splicing to meet the large market,high resolution and multi spectral detection capability of infrared early warning satellites. In this paper,the development status and technical route of multi chip and multi spectrum splicing infrared detector components at home and abroad are compared,and the application prospects of miniaturized splicing detectors in other fields are prospected. Finally,the main problems existing in the development of large size splicing infrared detectors are pointed out.