Digital image correlation strain measurement of thick adherend shear test specimen joined with an epoxy film adhesive |
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| Affiliation: | 1. Institute for future transport and cities, Coventry University, CV1 5FB, United Kingdom;2. Enhanced Composites and Structures Centre, School of Aerospace, Transport and Manufacturing, Cranfield University, MK43 0AL, United Kingdom;1. Université Paris-Est, Laboratoire Modélisation et Simulation Multi Echelle, MSME UMR 8208 CNRS, 5 bd Descartes, 77454 Marne la Vallée, France;2. Civil Engineering and Environmental Laboratory (LGCIE) – Site Bohr, University Claude Bernard Lyon 1, 82, Boulevard Niels Bohr, Campus de la DOUA, 69622 Villeurbanne Cedex, France;3. Department of Civil and Environmental Engineering, University of Catania, V.le A.Doria, 6, 95125 Catania, Italy;1. German Aerospace Center(DLR), Institute of Composite Structures and Adaptive Systems, Lilienthalplatz 7, 38108 Braunschweig, Germany;2. Fraunhofer Institute for Wind Energy Systems, Am Seedeich 45, 27572 Bremerhaven, Germany;3. University of Bremen, Bibliothekstraße 1, 28359 Bremen, Germany;1. German Aerospace Center (DLR), Institute for Composite Structures and Adaptive Systems, Braunschweig, Germany;2. Fraunhofer, Institute for Wind Energy Systems (IWES), Am Seedeich 45, 27572 Bremerhaven, Germany |
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| Abstract: | Structural bonding and bonded repairs of composite materials become more and more important. Understanding the strain within the bondline leads to suitable bonding design. For new design approaches the strain distribution within the bondline has to be analyzed. Thus, often finite element analysis (FE) are used. However, a huge challenge is the availability of reliable material properties for the adhesives and their validation. Previous work has shown that it is possible to measure the small displacements resulting within thin epoxy film adhesives using high resolution digital image correlation (DIC). In this work a 2D DIC setup with a high resolution consumer camera is used to visualize the strain distribution within the bondline over the length of the joint as well as over the adhesive thickness. Therefore, single lap joints with thick aluminum adherends according to ASTM D 5656 are manufactured and tested. Local 2D DIC strain measurements are performed and analyzed. Two different camera setups are used and compared. The evaluation provides reliable material data and enables a look insight the bondline. The results of the full field strain data measured with DIC are compared with numerical simulations. Thus, material models as well as chosen parameters for the adhesive are validated. Compared to extensometers, giving only point-wise information for fixed measuring points, the DIC allows a virtual point-wise inspection along the complete bondline. Furthermore, it allows measuring close to the bondline to reduce the influence of adherend deformation. |
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| Keywords: | Adhesive bonding Digital image correlation (DIC) Epoxides (A) Destructive testing (C) Mechanical properties of adhesives (C) |
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