| CSP封装Sn-3.5Ag焊点的热疲劳寿命预测 |
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| 引用本文： | 韩 潇,丁汉,盛鑫军,张波. CSP封装Sn-3.5Ag焊点的热疲劳寿命预测[J]. 半导体学报, 2006, 27(9): 1695-1700 |
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| 作者姓名： | 韩 潇 丁汉 盛鑫军 张波 |
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| 作者单位： | 上海交通大学机械与动力工程学院 先进电子制造中心,上海 200030;上海交通大学机械与动力工程学院 先进电子制造中心,上海 200030;上海交通大学机械与动力工程学院 先进电子制造中心,上海 200030;上海交通大学机械与动力工程学院 先进电子制造中心,上海 200030 |
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| 摘 要： | 对芯片尺寸封装(CSP)中Sn-3.5Ag无铅焊点在热循环加速载荷下的热疲劳寿命进行了预测.首先利用ANSYS软件建立CSP封装的三维有限元对称模型,运用Anand本构模型描述Sn-3.5Ag无铅焊点的粘塑性材料特性;通过有限元模拟的方法分析了封装结构在热循环载荷下的变形及焊点的应力应变行为,并结合Darveaux疲劳寿命模型预测了无铅焊点的热疲劳寿命.
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| 关 键 词： | 芯片尺寸封装 无铅焊点 Anand本构模型 疲劳寿命 有限元分析 封装结构 焊点 疲劳寿命预测 Time Prediction Fatigue Life Thermal Package Scale Chip 寿命模型 结合 应变行为 应力 变形 热循环载荷 分析 方法 有限元模拟 材料特性 粘塑性 |
| 文章编号： | 0253-4177(2006)09-1695-06 |
| 收稿时间： | 2006-01-20 |
| 修稿时间： | 2006-03-02 |
Thermal Fatigue Life Time Prediction of Sn-3.5Ag Lead-Free SolderJoint for Chip Scale Package |
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| Han Xiao,Ding Han,Sheng Xinjun and Zhang Bo. Thermal Fatigue Life Time Prediction of Sn-3.5Ag Lead-Free SolderJoint for Chip Scale Package[J]. Chinese Journal of Semiconductors, 2006, 27(9): 1695-1700 |
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| Authors: | Han Xiao Ding Han Sheng Xinjun Zhang Bo |
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| Affiliation: | Advanced Electronic Manufacturing Center,School of Mechanical Engineering,Shanghai Jiao Tong University,Shanghai 200030,China;Advanced Electronic Manufacturing Center,School of Mechanical Engineering,Shanghai Jiao Tong University,Shanghai 200030,China;Advanced Electronic Manufacturing Center,School of Mechanical Engineering,Shanghai Jiao Tong University,Shanghai 200030,China;Advanced Electronic Manufacturing Center,School of Mechanical Engineering,Shanghai Jiao Tong University,Shanghai 200030,China |
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| Abstract: | The thermal fatigue life time of Sn-3.5Ag lead-free solder joint of a chip scale package subjected to a thermal cycling load is predicted.Using the finite element analysis software ANSYS,a three dimensional symmetric model of the chip scale package is established,which uses the Anand constitutive model to describe the viscoplastic material property of Sn-3.5Ag lead-free solder joints.The deformation of the CSP package and the stress-strain variation of the solder joint under a thermal cycling load are investigated through thermal stress analysis.The Darveaux fatigue life prediction method is used to calculate the fatigue life time of the lead-free solder joint based on the finite element simulation results. |
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| Keywords: | chip scale package lead-free solder joint Anand constitutive model fatigue life finite element analysis |
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