板级封装焊点的振动冲击加速失效方法研究

设计了一种针对板级微电子封装微焊点的振动冲击加速失效试验。对线路板施加定频正弦振动载荷，测量线路板应变值以标定PCB板级载荷水平，采用高速数据采集系统记录了振动载荷作用下的微焊点失效动态过程。结果表明：通过调节振动条件，采用板级振动试验可以获得近似板级跌落冲击试验的峰值形变，其峰值载荷作用频次高于跌落冲击试验；失效数据监测结果显示焊点在振动冲击试验中表现为疲劳失效特征。本加速失效试验在保持焊点失效特征的同时提高了试验效率，可作为跌落冲击条件下微焊点板级可靠性评估的备选试验方案。

Study on accelerated test for board level solder interconnects reliabilityusing vibration shock loading

An accelerated test was designed for evaluating vibration shock resistance of board level solder interconnects. Vibration was loaded upon PCB in cyclic sinusoidal wave mode with single frequency. Vibrating condition was adjusted to simulate drop impact loading amplitude. Loading intensities was characterized using strain measurements. The solder failure process was recorded with a high speed data acquisition system. Results show that a similar loading intensity of drop impact could be obtained using vibration shock method. The loading repetition frequency of vibration shock is higher than that of drop impact. Solder interconnects appeared fatigue characteristic during accelerated failure test. The accelerated test in this work increased the test efficiency with no failure mode shift. Hence, it could be an alternative method for board level shock reliability evaluation.