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| Growth mechanism of intermetallic compounds and damping properties of Sn–Ag–Cu-1 wt% nano-ZrO2 composite solders | |
| 摘 要： | |
| 收稿时间： | 5 March 2013 |
| 修稿时间： | 27 January 2014 |
| 本文献已被 ScienceDirect 等数据库收录！ | |
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