| 刚挠背板动力学仿真与焊点可靠性研究 |
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| 引用本文： | 史经辉,吴兆华,黄春跃. 刚挠背板动力学仿真与焊点可靠性研究[J]. 电子元件与材料, 2009, 28(5). DOI: 10.3969/j.issn.1001-2028.2009.05.022 |
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| 作者姓名： | 史经辉 吴兆华 黄春跃 |
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| 作者单位： | 1. 桂林电子科技大学,机电工程学院,广西,桂林,541004;南通航运职业技术学院,江苏,南通,226010
2. 桂林电子科技大学,机电工程学院,广西,桂林,541004 |
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| 基金项目： | 国防预研资助项目，广西研究生科研创新资助项目 |
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| 摘 要： | 根据通信设备中刚挠背板互联结构,建立了有限元模型。采用两种约束方案,通过模态分析获得其固有频率和振型;通过随机振动分析,获得其应力应变;根据Coffin-Manson经验公式,结合三带技术建立了互联焊点的振动疲劳寿命预测模型,并计算了其疲劳损伤。结果表明:备用状态下互联结构的一阶固有频率为141Hz,工作状态下为988Hz;随机振动负载条件下刚挠结合部位及焊点与刚性背板连接区为应力集中区;对备用状态下互联结构施加z方向激励,焊点的疲劳损伤最大。
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| 关 键 词： | 刚挠背板 焊点 可靠性 |
Study on dynamics simulation and reliability of solder joints of rigid-flex backplane |
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| SHI Jinghui,WU Zhaohua,HUANG Chunyue. Study on dynamics simulation and reliability of solder joints of rigid-flex backplane[J]. Electronic Components & Materials, 2009, 28(5). DOI: 10.3969/j.issn.1001-2028.2009.05.022 |
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| Authors: | SHI Jinghui WU Zhaohua HUANG Chunyue |
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| Affiliation: | 1. School of Mechanical & Electrical Engineering;Guilin University of Electronic Technology;Guilin 541004;Guangxi Zhuangzu Zizhiqu;China;2. Nantong Shipping College;Nantong 226010;Jiangsu Province;China |
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| Abstract: | Based on the rigid-flex backplane interconnect structure of communication equipments, the finite element model (FEM) was set up. Using two types of constraint programme, the natural frequency and vibration modes were obtained through modal analysis. After random-vibration analysis, stress and strain of the interconnect structure were obained. According to Coffin-Manson experience formula combining with three-band technology, the interconnect solder joints vibration fatigue life prediction model was develope... |
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| Keywords: | rigid-flex backplane solder joint reliability |
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