| 无铅焊接工艺及失效分析 |
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| 引用本文： | 黄卓,杨俊,张力平,陈群星,田民波.无铅焊接工艺及失效分析[J].电子元件与材料,2006,25(5):69-72. |
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| 作者姓名： | 黄卓 杨俊 张力平 陈群星 田民波 |
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| 作者单位： | 1. 清华大学材料科学与工程系,北京,100084
2. 振华亚太高新电子材料有限公司,贵州,贵阳,550018 |
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| 基金项目： | 国家高技术研究发展计划(863计划) |
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| 摘 要： | 综述了目前无铅焊接工艺回流焊和波峰焊的工艺特点,指出了焊接中存在的几大主要失效问题,包括开裂、焊点空洞、晶须和板材胀裂,并介绍了避免或减弱这些失效问题的方法。
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| 关 键 词： | 电子技术 无铅焊料 工艺 失效 开裂 焊点空洞 晶须 |
| 文章编号： | 1001-2028（2006）05-0069-04 |
| 收稿时间： | 2005-12-20 |
| 修稿时间： | 2005-12-20 |
Lead-free Jointing Technology and Analysis of Its Failures |
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| HUANG Zhuo,YANG Jun,ZHANG Li-ping,CHEN Qun-xing,TIAN Min-bo.Lead-free Jointing Technology and Analysis of Its Failures[J].Electronic Components & Materials,2006,25(5):69-72. |
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| Authors: | HUANG Zhuo YANG Jun ZHANG Li-ping CHEN Qun-xing TIAN Min-bo |
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| Affiliation: | 1. Department of Materials Science and Engineering, Tsinghua University, Beijing 100084, China; 2. Zhenhua Asia-Pacific High-Tech Electronic Materials Co., Ltd, Guiyang 550018, China |
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| Abstract: | The characteristics of the lead-free jointing technology and the main causes of its failures were summarized, include lift-off, solderpoint voids and Sn whisker etc. Also some methods to avoid or lower these failures were given. |
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| Keywords: | electronic technology lead-free solder technology failure lift-off solderpoint voids Sn whisker |
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