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RF/wireless-interconnect: The next wave of connectivity |
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| Authors: | TAM SaiWang & CHANG Mau-Chung Frank Electrical Engineering Department University of California Los Angeles Los Angeles CA USA |
| Affiliation: | TAM SaiWang & CHANG Mau-Chung Frank Electrical Engineering Department,University of California Los Angeles,Los Angeles,CA 90095,USA |
| Abstract: | In the era of the nanometer CMOS technology, due to stringent system requirements in power, performance and other fundamental physical limitations (such as mechanical reliability, thermal constraints, overall system form factor, etc.), future VLSI systems are relying more on ultra-high data rates (up to 100 Gbps/pin or 20 Tbps aggregate), scalable, re-configurable, highly compact and reliable interconnect fabric. To overcome such challenges, we first explore the use of multiband RF/wireless-interconnects wh... |
| Keywords: | RF-interconnect wireless RF-interconnect network-on-chips multi-band 3-dimensional integrated circuit advanced memory interface wireless contactless connector |
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