| 无铅焊膏用助焊剂的制备与研究 |
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| 引用本文： | 李国伟,雷永平,夏志东,史耀武,徐冬霞. 无铅焊膏用助焊剂的制备与研究[J]. 电子元件与材料, 2007, 26(8): 24-27 |
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| 作者姓名： | 李国伟 雷永平 夏志东 史耀武 徐冬霞 |
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| 作者单位： | 北京工业大学,材料学院,先进电子连接材料实验室,北京,100022;北京工业大学,材料学院,先进电子连接材料实验室,北京,100022;北京工业大学,材料学院,先进电子连接材料实验室,北京,100022;北京工业大学,材料学院,先进电子连接材料实验室,北京,100022;北京工业大学,材料学院,先进电子连接材料实验室,北京,100022 |
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| 基金项目： | 国家高技术研究发展计划(863计划) , 北京市教委科研项目 , 北京市自然科学基金 |
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| 摘 要： | 无铅焊膏用助焊剂需要一定的黏性,选择有机酸和有机胺混合作为活性物质,配合一定量的松香配制出一种助焊剂。通过控制助焊剂中松香的含量,降低不挥发物的含量,减少残留物对元器件的腐蚀。依据标准对所配制的助焊剂进行了性能测试,并与一种松香含量较高的助焊剂比较。结果表明:助焊剂的松香含量降低约10%,在260℃焊接后不挥发物含量降低了近6%,黏度较好,无卤化物,无毒,环保,符合焊膏用助焊剂的要求。
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| 关 键 词： | 电子技术 助焊剂 无铅焊膏 松香 不挥发物 |
| 文章编号： | 1001-2028（2007）08-0024-04 |
| 修稿时间： | 2007-03-29 |
Study of a new flux for lead-free solder paste |
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| LI Guo-wei,LEI Yong-ping,XIA Zhi-dong,SHI Yao-wu,XU Dong-xia. Study of a new flux for lead-free solder paste[J]. Electronic Components & Materials, 2007, 26(8): 24-27 |
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| Authors: | LI Guo-wei LEI Yong-ping XIA Zhi-dong SHI Yao-wu XU Dong-xia |
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| Affiliation: | Laboratory of Advanced Electronic Joining Materials, Beijing University of Technology, Beijing 100022, China |
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| Abstract: | Active agent mixed with organic acid and organic amine were applied to keep good viscosity of flux for lead-free solder paste.In order to reduce the corrosion of components caused by the residue,the amount of rosin was controlled.It reduced significantly the amount of non-volatile matter.The properties of this flux were tested according to the industry standard,and compared with a flux which contains a high amount of rosin.The results show that when the amount of rosin decreased about 10 %,the amount of non-volatile matter reduced by 6 % after 260 ℃ welding,the flux is good viscosity,and it is halogen-free,nontoxic and environmentally friendly,thus it meets the needs of lead-free solder paste. |
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| Keywords: | electron technology flux lead-free solder paste rosin non-volatile matter |
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