Reliability study of Sn–Ag–Cu–Ce soldered joints in quad flat packages |
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Authors: | Liang Zhang Song-bai Xue Li-li Gao Zhong Sheng Sheng-lin Yu Yan Chen Wei Dai Feng Ji Zeng Guang |
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Affiliation: | a College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China;b The 14th Research Institute, China Electronics Technology Group Corporation, Nanjing 210013, China;c Harbin Welding Institute, Harbin 150080, China |
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Abstract: | The reliability of Sn–Ag–Cu–Ce lead-free soldered joints in quad flat packages under thermal cycling was investigated based on finite element simulation and experiments. The stress and strain response of fine pitch QFP device lead-free soldered joints were analyzed using finite element method based on Garofalo–Arrhenius model. The simulated results indicate that the creep distribution is not uniform, the heel of joints is the maximum creep strain concentrated sites. And comparisons were then made with experimental results of the cracks observed in the Sn–Ag–Cu–Ce soldered joints subjected to the temperature cycled experiment. In addition, the relative mechanical and metallurgical factors, which dominate the failure of soldered joints, were utilized to analyze the phenomena. The fracture surfaces indicate that crack initiate and propagate along the interface among bulk Cu6Sn5 phases in Sn–Ag–Cu–Ce soldered joints. |
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