| 考虑热力学和动力学相关性的二元合金凝固界面动力学建模 |
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| 引用本文： | 李述,张玉兵,王慷,刘峰. 考虑热力学和动力学相关性的二元合金凝固界面动力学建模[J]. 中国有色金属学会会刊, 2021, 31(1): 306-316. DOI: 10.1016/S1003-6326(21)65497-3 |
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| 作者姓名： | 李述 张玉兵 王慷 刘峰 |
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| 作者单位： | 西北工业大学凝固技术国家重点实验室;哈尔滨理工大学理学院 |
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| 基金项目： | The authors are grateful for the financial supports from the National Natural Science Foundation of China(51671075 and 51790481);the National Key R&D Program of China,(2017YFB0703001 and 2017YFB0305100);China Postdoctoral Science Foundation(2016M590970);the Fund of the State Key Laboratory of Solidification Processing in NWPU,China(SKLSP201606);the Fundamental Research Foundation for Universities of Heilongjiang Province,China(LGYC2018JC004);the Heilongjiang Postdoctoral Fund for Scientific Research Initiation,China(LBH-Q16118). |
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| 摘 要： | 在同时考虑碰撞限制生长模式和短程扩散限制生长模式的情况下,提出一个更加完善且具有可变动力学前因子的二元合金固?液界面动力学模型.与上述两种生长模式相耦合,提出4种潜在的热力学和动力学相关性,并将其应用于平界面迁移和枝晶凝固.其中,有效热力学驱动力与有效动力学能垒间的线性相关性更符合物理实际.基于此线性热力学和动力学相关...
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| 关 键 词： | 建模 界面 枝晶凝固 二元合金 热力学 动力学 相关性 |
| 收稿时间： | 2020-03-27 |
Interface kinetics modeling of binary alloy solidification by considering correlation between thermodynamics and kinetics |
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| Shu LI,Yu-bing ZHANG,Kang WANG,Feng LIU. Interface kinetics modeling of binary alloy solidification by considering correlation between thermodynamics and kinetics[J]. Transactions of Nonferrous Metals Society of China, 2021, 31(1): 306-316. DOI: 10.1016/S1003-6326(21)65497-3 |
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| Authors: | Shu LI Yu-bing ZHANG Kang WANG Feng LIU |
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| Affiliation: | 1. State Key Laboratory of Solidification Processing, Northwestern Polytechnical University, Xi''an 710072, China;2. School of Science, Harbin University of Science and Technology, Harbin 150080, China |
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| Abstract: | By considering collision-limited growth mode and short-range diffusion-limited growth mode simultaneously,an extended kinetic model for solid?liquid interface with varied kinetic prefactor was developed for binary alloys.Four potential correlations arising from effective kinetics coupling the two growth modes were proposed and studied by application to planar interface migration and dendritic solidification,where the linear correlation between the effective thermodynamic driving force and the effective kinetic energy barrier seems physically realistic.A better agreement between the results of free dendritic growth model and the available experiment data for Ni?0.7at.%B alloy was obtained based on correlation between the thermodynamics and kinetics.As compared to previous models assuming constant kinetic prefactor,a common phenomenon occurring at relatively low undercoolings,i.e.the interface migration slowdown,can be ascribed to both the thermodynamic and the kinetic factors.By considering universality of the correlation between the thermodynamics and kinetics,it is concluded that the correlation should be considered to model the interface kinetics in alloy solidification. |
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| Keywords: | modelling interface dendritic solidification binary alloy thermodynamics kinetics correlation |
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