A study of the transient liquid phase bonding process applied to a Ag/Cu/Ag sandwich joint |
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Authors: | Isaac Tuah-Poku M Dollar TB Massalski |
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Affiliation: | (1) Mount Technology, AT & T, Engineering Research Center, 08540 Princeton, NJ;(2) Department of Metallurgical Engineering and Materials Science, Carnegie Mellon University, 15213 Pittsburgh, PA;(3) Present address: Academy of Mining and Metallurgy, Krakow, Poland |
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Abstract: | Transient liquid phase (TLP) bonding is a process currently used for joining heat resistant alloys, for example nickel- and
cobalt-based superalloys. It involves the formation of a liquid layer between two adjoining pieces and the formation of a
solid bond as the liquid disappears during annealing at a suitable constant temperature. In the present study, a model Ag/Cu/Ag
sandwich joint associated with a simple eutectic phase diagram was used to study the different stages of this process. The
results confirm that the TLP bonding is a diffusional process occurring in clearly distinctive stages. The two most important
stages are the widening and homogenization of the previously dissolved liquid interlayer, and the subsequent solidification
and shrinking of the interlayer. Whereas the former stage involves diffusional processes both in the liquid phase and in the
adjoining solids, the latter is controlled mainly by the diffusion in the solid phase. A modeling approach has been explored
which shows that in most eutectic systems there exists an optimal bonding temperature corresponding to the shortest time needed
for complete solidification. The results of a study on a Ag/Ag-20 wt pct Cu/Ag sandwich joint provide evidence that the use
of an alloy close to the eutectic composition as an interlayer material shortens the TLP process substantially. |
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