| SMC焊点形态预测与可靠性分析程序的接口 |
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| 引用本文： | 赵秀娟,王春青,郑冠群,杨士勤.SMC焊点形态预测与可靠性分析程序的接口[J].电子工艺技术,2000,21(3):101-103. |
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| 作者姓名： | 赵秀娟 王春青 郑冠群 杨士勤 |
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| 作者单位： | 哈尔滨工业大学黑龙江哈尔滨 150001 |
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| 摘 要： | 在SMT焊点三维形态预测结果的基础上 ,生成了分析焊点力学性能的三维实体模型 ,设计了自动接合焊点形态预测与可靠性分析的接口程序。
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| 关 键 词： | 接口 焊点形态预测 可靠性分析程序 SMC |
| 文章编号： | 1001-3474(2000)03-0101-03 |
| 修稿时间： | 1999年12月27日 |
Interface of Solder Joint Shape Prediction of RC Chip and Reliability Analysis in SMT |
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| ZHAO Xiu-juan,WANG Chun-qing,ZHENG Guan-qun,YANG Shi-qin.Interface of Solder Joint Shape Prediction of RC Chip and Reliability Analysis in SMT[J].Electronics Process Technology,2000,21(3):101-103. |
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| Authors: | ZHAO Xiu-juan WANG Chun-qing ZHENG Guan-qun YANG Shi-qin |
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| Abstract: | A three-dimensional solid mechanical model for analyzing the mechanical behavior of solder joints is created according to the results of predicting the shape of SMT solder joints.A program is developed to integrate automatically solder joint shape prediction and reliability analysis. |
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| Keywords: | Interface Solder joint shape prediction Reliability analysis |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ |
