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新型耐高温胶粘剂的制备与性能研究
引用本文:罗甜,魏明坤.新型耐高温胶粘剂的制备与性能研究[J].广州化工,2010,38(10):114-115,117.
作者姓名:罗甜  魏明坤
作者单位:武汉市武汉理工大学理学院,湖北,武汉,430070
摘    要:介绍了双马来酰亚胺(BM I)/二烯丙基双酚A(DABPA)/环氧树脂(E-51)耐高温胶粘剂体系的制备,选择BM I/DAB-PA/E-51三元体系的最佳配比,进行力学性能,粘接性能,DMA,TG等测试,表征了改性胶粘剂的综合性能。试验结果表明:当BM I/DABPA/E-51的质量比为4:1:1时,胶粘剂体系在250℃时,拉伸强度仍有5.8MPa,适合于做耐高温结构胶。

关 键 词:双马来酰亚胺  二烯丙基双酚A  环氧树脂  耐高温胶粘剂

Research on the Preparation and Properties of New Heat-resistant Adhesive
LUO Tian,WEI Ming-kun.Research on the Preparation and Properties of New Heat-resistant Adhesive[J].GuangZhou Chemical Industry and Technology,2010,38(10):114-115,117.
Authors:LUO Tian  WEI Ming-kun
Affiliation:(School of Science,Wuhan University of Technology,Hubei Wuhan 430070,China)
Abstract:The preparation of bismaleimide(BMI)/ortho-diallyl bisphenol A(DABPA)/epoxide(E-51) resin systems was discussed,and the best ratio of BMI/DABPA/E-51 ternary system was chosen for mechanical properties,adhesive properties,DMA,TG and other tests to characterize the overall performance of modified adhesive.The results showed that when the ratio(wt) of BMI/DABPA/E-51 was 4:1:1,the tensile strength of the adhesive system was still 5.8MPa in 250℃,and it was suitable for being heat-resistant structural adhesive.
Keywords:bismaleimide  ortho-diallyl Bisphenol A  expoxy resin  heat-resistant adhesive
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