| 芯片粘接失效模式及粘接强度提高途径 |
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| 引用本文： | 葛秋玲,王洋,丁荣峥.芯片粘接失效模式及粘接强度提高途径[J].电子与封装,2009,9(6):1-4. |
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| 作者姓名： | 葛秋玲 王洋 丁荣峥 |
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| 作者单位： | 无锡中微高科电子有限公司,江苏,无锡,214035 |
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| 摘 要： | 芯片粘接质量是电路封装质量的一个关键方面，它直接影响电路的质量和寿命。文章从芯片粘接强度的失效模式出发，分析了芯片粘接失效的几种类型，并从失效原因出发对如何在芯片粘接过程中提高其粘接强度提出了四种解决途径和方法，对提高芯片粘接强度和粘接可靠性具有参考价值。文章还指出了芯片粘接强度测试过程中的一些不当或注意点及其影响，并对不当的测试方法给出了改进方法，能有效地避免测试方法不当带来的误判。
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| 关 键 词： | 失效模式 粘接强度 提高途径 测试方法 粘接可靠性 |
Failure Mode of Die Bonding and Improved Path of Bonding Strength |
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| GE Qiu-ling,WANG Yang,DING Rong-zheng.Failure Mode of Die Bonding and Improved Path of Bonding Strength[J].Electronics & Packaging,2009,9(6):1-4. |
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| Authors: | GE Qiu-ling WANG Yang DING Rong-zheng |
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| Affiliation: | Wuxi Zhongwei High-tech Electronics Co.;Ltd.;Wuxi 214035;China |
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| Abstract: | Die bonding quality is a key factor in the circuit manufacturing,that straightly affects the circuits quality and life. From the failure mode of the die bonding strength,the article analysis a few of the failure mode of the die bonding,and based the failure reasons the article advances four approaches to improve the reliability of the die bonding strength in die bonding processing,which has referenced value to the die bonding strength and its reliability. In addition,the article points improper or wrong tes... |
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| Keywords: | failure mode bonding strength improved path measure methods adhere reliability |
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