| 时效处理对Sn-Ag-Cu-Bi无铅钎料显微组织和力学性能的影响 |
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| 引用本文： | 赵杰,戚琳,王来,刘强,关建华.时效处理对Sn-Ag-Cu-Bi无铅钎料显微组织和力学性能的影响[J].中山大学学报(自然科学版),2003,42(Z1):28-31. |
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| 作者姓名： | 赵杰 戚琳 王来 刘强 关建华 |
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| 作者单位： | 大连理工大学材料工程系,辽宁,大连,116024 |
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| 摘 要： | 主要研究了时效处理对Sn-3Ag-0.5Cu、Sn-3Ag-0.5Cu-1Bi、Sn-3Ag-0.5Cu-3Bi无铅钎料显微组织和力学性能的影响,并根据试验结果讨论了Bi元素的作用.试验结果表明Bi的加入提高了钎料的抗拉强度,但降低了其延伸率.通过在不同温度下时效处理,在含Bi的钎料中,Bi在Sn基体中析出,而含Bi的钎料表现出相对稳定的力学性能.这可归因于Bi的固溶强化与弥散强化作用的转化.
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| 关 键 词： | 无铅钎料 微观组织 时效 拉伸性能 |
Microstructures Evolution and Its Influence on Mechanical Properties in Sn-Ag-Cu-Bi Lead-free Solders After Aging Treatment |
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| Abstract.Microstructures Evolution and Its Influence on Mechanical Properties in Sn-Ag-Cu-Bi Lead-free Solders After Aging Treatment[J].Acta Scientiarum Naturalium Universitatis Sunyatseni,2003,42(Z1):28-31. |
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| Authors: | Abstract |
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| Abstract: | The current work investigated the influence of aging time on microstructures and mechanical properties in Sn-3Ag-0.5Cu, Sn-3Ag-0.5Cu-1Bi and Sn-3Ag-0.5Cu-3Bi solders. The effect of Bi was discussed based on the experimental results. The experimental results indicated that: the addition of Bi increased the tensile strength of the solders but decreased their elongation. After aging at different temperatures, Bi precipitated in Sn matrix in Bi-bearing solders, while the Bi-bearing solders exhibited stable mechanical properties. This can be attributed to the strengthening effect of Bi from solid solution strengthening to precipitating strengthening in the solders. |
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| Keywords: | Pb-free solder microstructure aging tensile properties |
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